Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

There is no single industry-standard method of wafer-level packaging at present.

A major application area of WLPs are smartphones due to the size constraints.
The Wafer Level Packaging Market report analyses the impact of COVID-19 on this industry. COVID-19 can affect the global market in 3 ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on enterprises and financial markets.

The report offers detailed coverage of Wafer Level Packaging industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Wafer Level Packaging by geography. The report splits the market size, by volume and value, on the basis of application type and geography.

The report forecast global Wafer Level Packaging market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2027.

First, this report covers the present status and the future prospects of the global Wafer Level Packaging market for 2015-2027.

Key Companies
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd

Wafer Level Packaging Market by Type
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP

At the same time, we classify Wafer Level Packaging according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
The report conveys the entirety of current realities about market definition, orders, applications, and commitment for the Wafer Level Packaging market that are basic to be victorious inside the market. The principle motivation behind this report is to give a development map with respect to the activities taken by central participants of the Wafer Level Packaging market like item dispatches, joint endeavors, propensities, consolidations, and acquisitions which is influencing the Wafer Level Packaging market undertaking in general and furthermore influencing the business, import, fare, income and CAGR values.

Regional Analysis
North America, Latin America, Asia-Pacific countries, Europe, India, China, and over twenty countries have been analyzed based on the different marketing elements such as manufacturing capacity, consumer base, productivity, and profit margin, and ease of business. It is observed that North America, in particular, will show impressive development during the estimated time frame in marketing development. Administration organizations and outsider managers are channelizing their efforts to make client-driven items that will add to the development of an efficient marketing scenario in these regions. As the significant parts of the market business would be all around the globe, Middle East, Africa, North America along with other Asia-Pacific nations shows a great prospect of developing a good market favorable environment.

The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Wafer Level Packaging market for the forecast period 2021 - 2027?
• What are the driving forces in the Wafer Level Packaging market for the forecast period 2021 - 2027?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Wafer Level Packaging industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?

For any other requirements, please feel free to contact us and we will provide you customized report.

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